Snapshot

  • Ticker: VECO (Nasdaq)
  • Bucket: AI Connectivity & Optics
  • Q1 2026 position: 233,923 shares, $7,920,633 — 0.16% of 13F (#50, outside the top 20); new position this quarter
  • HQ: Plainview, New York
  • What it does: Semiconductor capital equipment — laser spike annealing (LSA), ion beam deposition, wet processing and lithography tools for advanced packaging.

Business Overview

Veeco is a niche semicap supplier whose center of gravity has shifted to AI-adjacent process steps. 2025 revenue was 476.7M (72% of revenue), led by laser annealing and ion beam, while advanced-packaging tool revenue (wet processing and lithography) doubled from 150M in 2025 on AI demand. Strategically important: Veeco achieved production tool-of-record status for LSA at a leading HBM DRAM customer and shipped an LSA evaluation system to a second tier-1 DRAM maker.

Guidance calls for 2026 revenue of 555M year-end backlog. Management sizes the laser-annealing served market at ~$1.3B as gate-all-around logic and HBM adoption expand the application count.

Why Atreides Owns It

A small, surgical complement to the fund’s much larger Micron position: if HBM bit growth is the constraint that re-rates memory (Baker’s Sohn Montreal 2025 / “Watts and Wafers” thesis), the equipment enabling HBM capacity — laser annealing for advanced DRAM, wet processing and litho for the packaging stack — gets pulled along with high specificity. Veeco’s HBM tool-of-record win gives direct exposure to memory capex without paying the ~40x multiples Baker criticizes in large-cap semicap; Veeco trades at a fraction of that scale and visibility, with the advanced-packaging line growing 100%. New in Q1 2026 and at 0.16% it is the smallest public expression of the memory theme in the book — effectively a research position.

Position History

QuarterTypeShares/NotionalValue% of 13F
Q4 2024not held
Q1 2025not held
Q2 2025not held
Q3 2025not held
Q4 2025not held
Q1 2026Common233,923$7,920,6330.16%

First appearance in the 13F, initiated in the same quarter Micron grew to a top-5 position — consistent with a deliberate build-out of the memory/HBM supply chain theme.

Risks

  • Sub-scale semicap: Veeco competes for annealing share against Applied Materials and SCREEN, and customer tool decisions are winner-take-most per node.
  • Concentration: a handful of DRAM/logic customers drive semiconductor-segment revenue; slippage at one HBM customer materially changes the trajectory.
  • Non-semi drag: compound semiconductor, data storage and scientific segments shrank in 2025 and remain cyclical.
  • Memory capex timing: HBM equipment orders follow memory-maker capex plans, which can pause abruptly even mid-supercycle.

Sources